| Features |
- High-Speed Mapping Analysis
The combination of significantly improved
sensitivity of micro-spot fluorescent X-ray
analysis and continuous high-speed motorized
stage activation enables high-speed, elemental
mapping images. Special filters for lead mapping
in particular have been added to strengthen
compliance with lead mapping in the board.
It is also possible to detect even less than
1,000 ppm located in the lead-free solder.
- High Resolution, Wide Area Optical
System
A high resolution optical image of 20 micrometers
or less can be acquired over an area of 250mm
x 200mm. The location of measurement can be
specified directly from this optical image
with a high level of accuracy, resulting in
dramatically improved operability. Additionally,
overlapping the optical image with the mapping
image obtained by high-speed mapping enables
highly accurate analysis over a wide area.
- High-speed Measurement of Trace Metal
in Micro Spot
High sensitivity is possible through
the high-density micro X-ray beam, on-board
detector with a high count rate, and design
that employs the detection efficiency of a
fluorescent X-ray. The trace metals in the
micro-spots and thin film can be measured in
a short time. Hazardous substances in a 0.5mm
square area can be measured in approximately
100 seconds.
- High Count Rate Detector not Requiring
Liquid Nitrogen
Comes standard equipped with Seiko's
unique High Count Rate Detector Vortex, for
which the hassle of liquid nitrogen supply
is unnecessary. Additionally, start-up time
is as short as several minutes, and, as it
is a thermoelectric cooling type, it is highly
reliable. The device is very environmentally
friendly thanks to reduced power consumption
owing to increased measurement speed efficiency,
reduced carbon dioxide generation during manufacturing
and transportation of liquid nitrogen, and
other factors.
- Sequential Measurement
Up to 500 points on the samples on
the stage can be registered from the wide optical
view and each sample with different measurement
conditions can be analyzed automatically.
- Measurement of Film Thickness in Micro-spots
It is possible to measure the thickness
of a thin film composite plating of Au/Ni/Cu
(gold/nickel/copper) with an area of 0.2mm
square with high accuracy in approximately
10 seconds. In addition, trace amounts lead
contained in lead-free solder plating and electroless
nickel plating can also be analyzed.
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